Laser Cut SMT Solder Paste Stencils
Laser Cut Solder Paste Stencils are the most commonly used stencil
technology today. We have invested in the latest fiber diode laser system to
ensure accurate cutting down to half a micron. Pitch Apertures of .016 can easily
be achieved without electroforming. By utlizing a fiber diode laser along with
fine grain stainless steel, we are able to offer aperture/area ratio performances
that rivals electroform.
We can apply either general IPC 7525A Standards or follow your custom design
criteria when manufacturing your stencils. Lead Free Design and Pb-Free Green
Labels are available for your Lead Free RoHS Applications.
Gerber Editing Services
We also provide full Gerber Data Editing Services
Panelization Step & Repeat
Home Base & Pad Splits
Epoxy Design Applications
Custom Aperture Shapes
Lead Free Designs
Gerber Extended (RS-274x)
DXF / DWG
Top & Bottom Solderpaste
Top & Bottom Silkscreen
Top & Bottom Soldermask
Top & Bottom Signal/Copper Trace Files
Aperture File & Drill File
Fab & Assembly Drawing
Inspection & Scanner Technology
100% automatic inspection of screen/stencil for absence/presence and size of
Detect aperture size error down to 0.0005" (0.0125mm) at 3200 dpi. Compare new
Stencils and Screens against Gerber image for errors
Verify aperture sizes to 0.0005" and aperture absence/presence as small as 0.002"
Additional Photographic Imaging of all apertures to verify 100% complete cut
thru on every stencil delivered.